TEST SERVICES

ISS ESD & ENVIRONMENTAL TESTING LAB HAS THE EQUIPMENT ENGINEERING EXPERTISE OVER 25 YEARS OF EXPERIENCE TO SUPPORT IN-HOUSE FULL TEST AND DIAGNOSTIC SOLUTIONS.

Burn-in Product, Process, Reliability Qualification Capability and Capacities

REL In Cal 160 Fully Dynamic Burn-In

  • Up to 160 programmable I/O channels
  • Up to 6 zones with 48 slots
  • Up to individual driver drive 8 slots

Criteria (XXV) C25 6 zones, 48 slots / each Burn-in Systems (Capacity Available 4 ovens) for Mass productions.

  • Up to 4M vector depth, configurable from 48-96 channel

Individual 4 slot Burn-in Systems for custom burn-in per specification

  • Individual custom temperature and power supplies setting for device specification.
  • Up to 4M vector depth, configurable from 48-96 channels

Device Package Qualification Services Pre and Post (Preconditioning) Tests Includes

  • PRE-CSAM – CSAM testing to confirm if any Delamination or other anomalies exist prior to Pre-Conditioning

  • High Temperature Reverse Bias (HTRB)
  • Low Temperature Storage Life (LTSL)
  • Bake Oven – 24 hours bake to drive out any pre-existing moisture

  • Moisture Soak – As required by the customer

  • Solder Reflow – 3 cycles of solder reflow process

  • POST-CSAM – CSAM testing again to determine if any delamination occurred during the test.

  • Bias or Unbiased Highly Accelerated Stress Test (HAST)

  • Temperature Cycling (TCY)

  • High Temperature Storage (HTS)

  • Bias, Un Biased or Dynamic 85/85 stress testing (THB)

IC Qualifications For ESD

ESD Testing Services Offered

  • Human Body Model Testing (HBM)

  • Machine Model Testing (MM)

  • Charged Device Model Testing (CDM)

  • Latch-Up Testing (LU)

  • Methodology latest industry standard

 

 

 

 

Engineering and Hardware Capabilities

ISS offers complete turnkey solutions for PCB design, fabrication, assembly, and testing. Our highly experienced design team provides advanced PCB design solutions for a wide range of applications, including controlled impedance, high-speed differential signals, multilayer boards with maximum density, and fine-pitch designs.

ISS currently supports the following PCB technologies:

  • HTOL Burn-In Boards for all systems
  • HAST Boards
  • ATE Load Boards
  • ESD test Fixtures
  • Programmable Module PCB
  • Any types of Adaptors for Bench Testing
  • Customize Burn-In Oven System Back Planes

IC Package Failure Analysis

Comprehensive IC failure Analysis

  • Level 1/2/3 IC Failure Analysis

  • PCB Failure Analysis

  • Chemical Mechanical Decapsulation

  • Solder Joint Integrity
  • CSAM Evaluation
  • IC Process Evaluation | Documentation
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