TEST CAPABILITIES

ISS currently has equipment on hand for complete Reliability Support for Low and High Power Products, ESD Characterization and Testing Plans for High Pin count and Supply Count and all required stress tests for all product, process and package Qualification.

Burn-in Product, Process, Reliability Qualification Capability and Capacities

Mid power range MCC ABES-IV

  • Up to 128 individual free programmable I/O channel

  • Up to 5 power supplies, and 2MB vector

  • Up to 2 zones individual temperatures

REL In Cal 160 Fully Dynamic Burn-In

  • Up to 160 programmable I/O channels

  • Up to 6 zones with 48 slots

  • Up to individual driver drive 8 slots

Criteria (XXV) C25 6 zones, 48 slots / each Burn-in Systems (Capacity Available 8 ovens) for Mass productions.

  • Up to 4M vector depth, configurable from 48-96 channel

Individual Burn-in Systems for:

    • Individual custom temperature and power supplies setting for device specification.

    • Up to 4M vector depth, configurable from 48-96 channels

System supports HBM, MM, and Latch Up testing

System supports HBM, MM, and Latch Up testing

Thermo Key-Tek Paragon system compatible with MK2 platform; up to 768/1024 channels, pre and post curve tracing 768 channels but not limited to only 768 pins. Any reasonable high pin count devices can be accommodated with 768/1024 systems by special custom hardware. System has 3 power supplies, plus 2-3 power supplies can be accommodated extensionally. Currently can support majority of the hardware from the smallest 2×2 QFN to the largest QFN and the smallest BGA 10x10mm to the largest BGA 50x50mm. Any other oddball packages and pitches can be built for minimal cost.

 

 

 

 

 

 

 

 

System supports CDM testing

Model Oryx CDM 9000; No hardware required, any package size can be programmed for testing.