Burn-in Product, Process, Reliability Qualification Capability and Capacities

ISS services are capable of providing cost effective and economical solutions with existing integration solution for all Burn-in needs.

• HTOL (High Temp Operating Life)

• Dynamic HTOL with thermal runaway control

• Early Lifetime Failure

• Intelligent Life Test (test while burn-in)

• Burn-in Chambers (with complete scalable positions)

• Burn-in Test Program & 1st Article Test

• Adaptation to most common burn-in configurations and power requirements

Device Package Qualification Services Pre and Post (Preconditioning) Tests Includes

• PRE-CSAM – CSAM testing to confirm if any Delamination or other anomalies exist prior to Pre-Conditioning

• High Temperature Reverse Bias (HTRB)
• Low Temperature Storage Life (LTSL)

• Bake Oven – 24 hours bake to drive out any pre-existing moisture

• Moisture Soak – As required by the customer

• Solder Reflow – 3 cycles of solder reflow process

• POST-CSAM – CSAM testing again to determine if any delamination occurred during the test.

• Bias or Unbiased Highly Accelerated Stress Test (HAST)

• Temperature Cycling (TCY)

• High Temperature Storage (HTS)

• Bias, Un Biased or Dynamic 85/85 stress testing (THB)

IC Qualifications For ESD

ESD Testing Services Offered

• Human Body Model Testing (HBM)

• Machine Model Testing (MM)

• Charged Device Model Testing (CDM)

• Latch-Up Testing (LU)

• Methodology latest industry standard

Engineering and Hardware Capabilities

ISS offer Complete Turnkey Solutions for PCBs Design, Fabrication, Assembly and Testing.?ISS have highly experienced design team to provide high level designs for all applications matching impedance for high speed differential signal multi layers with maximum densities to fine pitch designs. Currently Supported PCB by ISS:

• HTOL Burn-In Boards for all systems

• HAST Boards

• ATE Load Boards

• ESD test Fixtures

• Programmable Module PCB

• Any types of Adaptors for Bench Testing

• Customize Burn-In Oven System Back Planes